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地址:福田保税区凤凰路2号
Process Engineer (Die Attach and Wire Bonding)
面议
  • 学历要求: 本科
  • 工作经验: 3-5 年
  • 更新时间: 2017-09-22
  • 招聘人数: 1
  • 招聘对象: 社会人才
  • 工作地区: 广东-深圳市-福田区
  • 年龄要求: 不限
  • 专业要求: 电子与通信工程;电子信息工程;机械电子工程;
KEY RESPONSIBILITIES:

· Responsible for process ownership of the Die Attach (eutectic and epoxy DA) and Wire Bonding Process in the assembly line.

· Develop the Die Attach/Wire bonding process for the new product.

· Establish statistical process control (SPC) monitoring in Die Attach / Wire Bonding operation.

· Improve yield & UPH of the assigned processes, including cost reduction activities.

· Troubleshooting and problem solving in the assembly line using FMEA and statistical engineering tools related.

· Performing DOE as necessary to make continuous improvements.



REQUIREMENTS:

· Masters/Bachelor's Degree in Electrical/Electronics/Materials/Mechanical Engineering or related.

· Good knowledge on failure analysis of die attach/wire bonding.

· Solid DOE, FMEA and SPC experience.

· Minimum 3 years of working experience in die attach process in MNC manufacturing environment.

· Very good communication skills and ability to work effectively in a cross functional environment with people at all levels and multiple sites.

· Good in spoken and written English.

· Good optical knowledge is preferred

· Experience in using Palomar, H&K and ESEC machines is preferred.

职位类别: 工艺工程师/工艺员

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  • 公司规模:100 - 499人
  • 公司性质:外商独资
  • 所属行业:光通信行业
  • 所在地区:广东-深圳市-福田区
联系方式
  • 联系人:Thomas
  • 手机:
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  • 邮箱:会员登录后才可查看
  • 邮政编码:518038
工作地址
  • 地址:福田保税区凤凰路2号